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Shenzhen racing precision technology co., LTD
Contact person: Mr Zhao
Contact phone number: 13724351262
Telephone: 0755-33818765
Address: shenzhen baoan district ShaJing Town xingye road YuDa rich industrial park

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Performance and characteristics of automatic solder machine
Release date:2015-12-23 Views:1386

1, the Yunnan Tin high purity tin material fused electrolytic copper, through a special refining process; rosin core is using high quality pure transparent hydrogenation of rosin with independent research and development of organic acid activator, after vacuum sealed container brewed. The impurity content is very few, the appearance of the tin wire is bright and clean.
In microelectronics, radio installed wiring, equipment assembly line, TV assembly line and other electronic industrial solder solder is applicable to the three types of 2, according to the activity of rosin core, R type (active low), the RMA (active), RA (high activity).
3, the product not only has the solder fast, less splash, solder joints bright, smoke small, high insulation resistance, the production process to add some convenient.
4, free cleaning, less residue; made of high-quality pure transparent hydrogenated rosin, bright spot, and less residual ion, clean and beautiful, insulation high resistance, corrosive is extremely low.
5, good versatility, fast solder; using international standard flux and vacuum sealing process, short wetting time and area of spreading, the maximum play active solder, so that the welding of copper and welding of nickel materials used at the same time, can greatly improve the efficiency.
6, pure and fresh smell, smoke less; the environmental tasteless flux, does not contain chemical substances reach control, welding spatter, smoke less, fresh scent.
7. Machine automatic soldering fluid, do not repair, production process with independent R & D and unique flux, as long as slightly modified rosin core ratio, then it can be used in automatic solder machine, is not empty solder, not even tin without rework traits.
8 solder joint is firm and stable; the thickness of the interface compound (IMC) layer can be effectively reduced, which makes the solder joints strong and durable, anti mechanical, and a thin layer of transparent protective film is formed on the surface of the solder joint.

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